Board-to-Board Bullets & Interposers

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Board-to-Board Bullets & Interposers represent Amphenol Military & Aerospace’s unified family of PCB‑to‑PCB interconnect solutions designed for direct, solderless, and impedance‑controlled signal transfer between stacked boards. This grouped entry consolidates two complementary product sets: RF PCB Bullets from SV Microwave and high‑speed Compliant Interposers from Amphenol CDI.

Board-to-Board RF PCB Bullets

SV Microwave spring‑loaded RF PCB bullets are precision 50 Ω coaxial couplers engineered to maintain continuous impedance and low VSWR across mechanical stack‑up variation. Each bullet bridges opposing SMP, SMPM, or SMPS interfaces, providing repeatable blind‑mate engagement within high‑density module arrays. The spring‑biased design delivers axial compliance and tolerance absorption that preserve signal integrity through vibration and temperature cycling.

• Interfaces: SMP / SMPM / SMPS precision push‑on series
• Design: spring‑loaded coaxial contact ensuring compression compliance
• Performance focus: broadband 50 Ω impedance control and low VSWR
• Applications: radar, EW, aerospace, test, and instrumentation modules
• Integration benefit: enables blind‑mate, high‑density RF packaging without cables

Quantum & Cryo Board‑to‑Board Interposers

Amphenol CDI Compliant Interposers provide solderless compression‑mount coupling between printed circuit boards for broadband data and RF paths. Using a 2.5 mm pitch compliant contact array, these interposers support high‑speed digital and RF channels with minimal insertion loss and ultra‑low crosstalk. They are compatible with both room‑temperature and cryogenic environments, offering a reworkable mechanical interface ideal for iterative laboratory and quantum‑system builds.

• Architecture: solderless compression‑mount PCB‑to‑PCB connection
• Electrical performance: controlled impedance and low insertion loss
• Mechanical design: compliant pins accommodating board‑stack tolerances
• Applications: quantum computing electronics, cryo measurement chains, and reworkable defense modules

Selection and Integration

Together these solutions address both RF coaxial and multi‑line high‑speed interposer needs at the board level. Engineers can design mixed architectures combining spring‑loaded RF bullets for GHz‑band signals and compression interposers for dense digital I/O or cryogenic paths. This unified category supports system designers pursuing compact, reworkable, and electromagnetically stable board‑stack interconnects that meet the performance demands of radar, EW, instrumentation, and quantum platforms.