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Amphenol Military & Aerospace provides mission-grade printed circuit boards designed for extreme reliability in defense and aerospace environments. This category encompasses rigid multilayer and HDI boards, flexible and length-unlimited flex circuits, rigid-flex configurations, RF and microwave substrates, metal-backed thermal management PCBs, and high-speed backplane assemblies. These technologies support platforms that demand high signal integrity, controlled impedance, and repeatable performance under mechanical and thermal stress. Explore the subcategories to review materials, stack-up design options, and manufacturing capabilities that align with MIL-PRF-31032 and IPC-6012 Class 3 standards.

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Muli-Port PCB Connectors

Available From: Amphenol CDI, IntelliConnect, SV Microwave

Rigid Printed Circuit Boards

Available From: Amphenol Printed Circuits

Single and Multi-Layer Flex Circuits

Available From: Amphenol Printed Circuits

Board-to-Board Bullets & Interposers

Grouped family of Amphenol Military & Aerospace board-to-board interconnect solutions combining SV Microwave 50 Ω RF PCB bullets and Amphenol CDI solderless compression interposers for high‑speed and cryogenic PCB‑to‑PCB integration.

Available From: Amphenol CDI, SV Microwave

Rigid Printed Circuit Board Assemblies

Available From: Amphenol Printed Circuits

Single Port RF PCB Connectors

Amphenol Military & Aerospace single‑port 50 Ω RF PCB connectors provide edge‑launch, thru‑hole, and compression‑mount coaxial interfaces—SMA, SMP, SMPM, SMPS, 2.92 mm, 2.4 mm, and 1.85 mm—for broadband, low‑VSWR board‑level interconnects in radar, SATCOM, EW, and embedded defense electronics.

Available From: Amphenol CDI, SV Microwave
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