Modular Circular Connectors

The GCB‑M Modular Circular Connector series from Amphenol Air LB Germany integrates the adaptability of modular inserts with the mechanical reliability of a robust circular form factor. Designed around the VG96955 mechanical standard, these connectors enable flexible configuration for power, signal, and data transmission in vibration‑intensive and environmentally exposed environments.

Modular Architecture

Each connector accommodates up to four EN4165/VG96513 (SIM series) modules with EN3155 contacts, providing over 230,000 unique contact arrangements. Module options include crimp, PCB, coax, twinax, differential‑pair, quadrax, and fiber‑optic termini. This design simplifies mixed‑signal integration, allowing engineers to consolidate multiple circuits within a single interface.

Mechanical and Environmental Performance

• Coupling system: Reverse‑bayonet locking mechanism offering secure, vibration‑resistant connection
• Sealing: IP67 protection against dust and temporary immersion
• Operating temperature: ‑55 °C to +125 °C
• EMC shielding: Fully screened shell construction for electromagnetic compatibility
• Material options: Thermoplastic inserts with aluminum alloy or marine bronze shells offered in multiple plating finishes (F1 to F8 variants)

Versions and Materials

Amphenol Air LB produces several service‑class versions including nickel‑, zinc‑cobalt‑, zinc‑nickel‑, and electrophoretic coated finishes for optimized corrosion resistance and EMI continuity. Marine‑bronze variants support coastal and offshore applications.

Applications

The GCB‑M platform supports a broad range of high‑reliability systems:

• Heavy commercial vehicles, construction, and mining machinery
• Industrial automation, robotics, and mechanical engineering
• Diagnostics, test, and measurement systems
• Power distribution, battery management, and motor control systems
• Marine and shipboard installations exposed to corrosive environments

Integration Guidance

Engineers can select GCB‑M connectors when a modular circular architecture is preferred over rectangular SIM interfaces, particularly where compact footprint, EMI protection, and environmental sealing are critical. The series supports hybrid layouts combining high‑current contacts with data and fiber modules, providing a scalable solution for modern electro‑mechanical systems.