Quantum & Cryo Board-To-Board Interposers

The Amphenol Military & Aerospace Quantum & Cryo Board‑To‑Board Interposers are high‑frequency, solderless connectors designed to link printed‑circuit boards directly while preserving signal integrity in demanding environments. Produced by Amphenol CDI, these compliant interposers utilize a mechanical compression architecture that eliminates solder joints and allows repeated assembly or rework without performance degradation.

Design and Performance

Each interposer integrates an array of spring‑loaded coaxial contacts on a 2.5 mm pitch. The controlled compression range ensures stable 50 Ω impedance, low insertion loss, and ultra‑low crosstalk between adjacent lines. By removing solder joints, the interface minimizes variability due to thermal stress and mechanical alignment, yielding consistent, repeatable RF characteristics beyond 40 GHz for microwave and high‑speed digital channels.

Mechanical and Integration Features

• Solderless compression‑mount construction – enables rework and reduces thermal exposure during assembly.
• Compact 2.5 mm pitch – supports high‑density PCB layouts in modules and stacked architectures.
• Axial‑compliant contact design – absorbs mechanical tolerance while maintaining impedance continuity.
• Supports single‑ended and differential signaling – compatible with coplanar waveguide (CPW) and stripline board geometries.

Applications

These interposers are suitable for systems where electrical repeatability and mechanical reliability are critical:

• Quantum computing and cryogenic control electronics
• Test and measurement instrumentation
• Military and aerospace signal modules
• 5G and optical‑to‑copper subsystems requiring compact high‑speed interconnects

Benefits

• Stable signal paths across repeated board insertions
• Reduced assembly complexity versus multi‑piece soldered connectors
• Improved mechanical alignment and long‑term durability
• Proven signal integrity for RF, microwave, and digital transmission lines

By combining mechanical precision with controlled RF performance, the Quantum & Cryo Board‑To‑Board Interposer extends Amphenol Military & Aerospace's expertise in high‑frequency and specialty‑environment connectivity to next‑generation embedded and cryogenic platforms.